Capability

Maximum active pcb size: 560 mm x 415 mm

Materials: High Tg Fr4, Polyimide, PTFE

Solder resists: Liquid photo-imageable, colours: green, red, blue, black, white, siver grey

Legend inks: white standard, yellow

Multi-layer: layer counts from 1 to 12 layers

PCB thicknesses from 0.2mm to 3.2 mm

Copper weights: 1/2 oz to 3 oz

PCB finishes:

Hot air solder level both lead-free and leaded

immersion silver (0.2 mic)

immersion gold (0.1 mic) over electroless nickel (5 mic)

Min track and gap: 0.1 mm on 1/2 oz copper start, 0.15 mm on 1 oz copper start, 0.2 mm on 2 oz copper start

Smallest drill at size 0.3mm

Maximum plated hole depth to diameter aspect ratio on a 1.6 mm thick pcb is 6:1

Mechanical: edge chamfering, counter-sinking, counter-boring, routing, scoring.

Electrical test specification
Test area: 610x500mm
Number of Probes: 2 Front, 2 Rear
Minimum board size: 76x76mm
Maximum board thickness for clamping: 6mm
Repeatable accuracy:  +/-10µm
Resolution:  6µm
Minimum pad pitch: 180µm
Test voltage of resistance measurement continuity test: 0-10V
Isolation test: 250V
Test current of resistance measurement continuity test: 2.65µA-150mA