Equipment

• Full anti-static protection on flooring, benches, clothing, bins, racking.
• Fume extraction by high volume low pressure ducted fan system.
• Fully equipped inspection & test

Laser stencil cutting:

LPKF Laser stencil cutter type G6060

Automatic SMD placement:

• 2 x Offline programming software, Aegis CircuitCAM & Graphicode GC Powerplace
• 2 x Solder paste screen printer Reprint R29 (automatic) with computerised vision camera alignment system.
• 1 x Automatic solder dispensing system, Essemtec CDS6720, with archimedean screw
• 1 x SMD placer: I-Pulse FV-7100, 6 head pick & place machine, 18,000 placements/hour
• 1 x SMD placer: I-Pulse M4E, 3 head pick & place machine, 12,500 placements/hour, 35 micron placement accuracy 
• 1 x SMD placer: I-Pulse M2, 6 head pick & place machine, 18,700 placements/hour, 30 micron placement accuracy, equipped to place parts as small as 0201.
• 6 x fast change feeder trolleys for above.
• Forced convection reflow oven: Concept 60 high velocity hot gas, computer controlled, with 4 zones top, & 4 zones bottom.
• Oven temperature profiling system: Solderstar Neptune.

Semi-automatic SMD placement:

2 x Essemtec EXPERT SAFP semi-automatic computer guided pick & place machines.

Manual SMD placement:

• Fritsch Manual solder paste / glue / fluid dispenser
• 5 x Fritsch SMD manual pick & place units c/w carousels, stick & tape feeders.
• 3 x manual solder paste stencil printers.

Through hole assembly / wiring:

• 10 x manual assembly stations c/w calibrated Kaisertech soldering irons.
• Lead-free pallet conveyor wave solderer type CMS400LF
• Cropmatic series 2 component wire cropper.

Re-work/Repair:

• Zevac DRS20 soldering and desoldering machine with capability to remove and place all types of SMD components including micro BGA’s.
• 2 x Hako 470/474 solder extraction guns.
• 1 x Hako 850 SMD hot-air rework unit.

Inspection / Test:

• AOI system & offline repair stations: Mirtec MV-2HTL
• Ersascope 2 Plus inspection system (capable of micro BGA inspection)
• BGA inspection: MS-1000LW BGA and fine-pitch inspection endoscope
• Vision Engineering Mantis optical inspection unit. (x2, x4, x10)
• Stereo microscope (x20)
• Intel PC controlled inspection microscope (x10, x60, x200)
• Oscilloscopes, bench-top power supplies, DVM’s, BERT tester, function generator, test PC’s etc.

Finishing:

• BJZ de-panelling machines for routered & scored PCB’s.
• Clarke 6" linesher.
• Branson 1510 Ultrasonic cleaning bath (1800cm3 capacity)

Other Equipment:

• ICE Technology programmer for PIC/GAL/EPROM etc.
• Bench drills
• IDC press tool