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Raw material specifications

Copper foil: RA copper 17.5, 35, 70 microns
Copper foil: ED copper 17.5, 35, 70 microns
Base film: Polyimide 17.5, 25, 50 microns
Base film: Polyester 25, 50, 75 microns
Coverlay: Polyimide 25, 50, 75 microns
Coverlay: Polyester 17.5, 35, 70 microns
Coverlay: Solder mask 25, 50 microns
Adhesive: Epoxy 20 - 35 microns
Adhesive: Acrylic 20 - 35 microns
Stiffener: Polymide 25 - 175 microns
Stiffener: Polyester 25 - 300 microns
Stiffener: Glass-epoxy 0.1 - 1.6 mm

Quality Assured

ISO 9001 Certificate 40205

ISO 9001 Certificate 24949 

IPC J-STD-001

UL Approval record
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