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Technical specifications

Minimum track & gap 0.075mm
Minimum hole diameter 0.3mm
Min total thickness, single sided 80 microns (inc CVL)
Min total thickness, double sided 210 microns (inc CVL)
Hole diameter tolerance, before plating +/-0.05mm
Hole diameter tolerance, after plating +/-0.10mm
Outline tolerance (Hard punch tool) +/-0.05mm
Pitch Tolerance +/-0.05mm
Conductor width tolerance +/-20% of width
Ni/Au plating thickness Au:1-200 microns
Ni/Au electroless plating thickness Au:1-5 microns
Tin/lead plating thickness 100-500 microns
Hot Air solder Levelling 200-800 microns
 Maximum economic length of flex circuit   500 mm

 

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