Minimum track & gap 0.075mm Minimum hole diameter 0.3mm Min total thickness, single sided 80 microns (inc CVL) Min total thickness, double sided 210 microns (inc CVL) Hole diameter tolerance, before plating +/-0.05mm Hole diameter tolerance, after plating +/-0.10mm Outline tolerance (Hard punch tool) +/-0.05mm Pitch Tolerance +/-0.05mm Conductor width tolerance +/-20% of width Ni/Au plating thickness Au:1-200 microns Ni/Au electroless plating thickness Au:1-5 microns Tin/lead plating thickness 100-500 microns Hot Air solder Levelling 200-800 microns
ISO 9001 Certificate 40205
ISO 9001 Certificate 24949
IPC J-STD-001
UL Approval record