Full anti-static protection on flooring, benches, clothing, bins, racking.
Fume extraction by high volume low pressure ducted fan system.
Laser stencil cutting
LPKF Laser solder paste stencil cutting machine type G6060 (2010).
4 x Aegis CircuitCAM offline component placement & documentation programming seats.
1 x Aegis Checkpoint Seat.
1 x Graphicode GC Powerplace seat.
1 x Siemens PLM - EM-Test Expert flying probe test programming seat.
Automatic SMD placement
2 x Solder paste screen printer Reprint R29 (automatic) with computerised vision camera alignment system (2007 & 2010).
2 x DEK Horizon 03ix in-line automatic solder paste printer with Hawkeye AOI paste inspection (2012).
1 x SMD placer: I-Pulse FV-7100, 6 head pick & place machine, 18,000 placements/hour.
1 x SMD placer: I-Pulse M4E, 3 head pick & place machine, 12,500 placements/hour, 35 micron placement accuracy (2007).
1 x SMD placer: I-Pulse M2, 6 head pick & place machine, 18,700 placements/hour, 30 micron placement accuracy, equipped to place parts as small as 0201 (2010).
6 x fast change feeder trolleys for above.
2 x SMD placers: I-Pulse M20, 4 head pick & place machine, 19,000 placements/hour, 25 micron placement accuracy, equipped to place parts as small as 01005, incorporating automatic lead coplanarity detection, with 8 x fast change feeder trolleys (2012).
1 x Forced convection reflow oven: Concept 60 high velocity hot gas, computer controlled, with 4 zones top, & 4 zones bottom.
2 x SMD Convection Reflow Oven Heller Model 1707 MK111 (2012).
2 x Nutek magazine line loader & un-loader (2012).
Oven temperature profiling system: Solderstar Neptune.
Semi-automatic SMD placement
2 x Essemtec EXPERT SAFP semi-automatic computer guided pick & place machines (2008).
Manual SMD placement
Fritsch Manual solder paste / glue / fluid dispenser
5 x Fritsch SMD manual pick & place units c/w carousels, stick & tape feeders.
3 x manual solder paste stencil printers.
Through hole assembly / wiring:
10 x manual assembly stations c/w calibrated Kaisertech soldering irons.
Lead-free pallet conveyor wave solderer type CMS400LF
Cropmatic series 2 component wire cropper.
1 x PDR focused infra red D35Vi BGA/SMT rework system (2012)
Zevac DRS20 soldering and desoldering machine with capability to remove and place all types of SMD components including micro BGA's.
2 x Hako 470/474 solder extraction guns.
1 x Hako 850 SMD hot-air rework unit.
Inspection / Test
Takaya APT-9411CE Flying Probe test system (2011).
Mirtec MV-2HTL AOI system & offline repair stations (2007).
Mirtec MV-3L AOI system, 5 M/Pixel camera, 4 x side cameras, intellibeam laser system & offline repair stations (2011).
Quins LC10 digital comparascope inspection system (2012)
Ersascope 2 Plus inspection system capable of micro BGA inspection (2011).
BGA inspection: MS-1000LW BGA and fine-pitch inspection endoscope
Vision Engineering Mantis optical inspection unit. (x2, x4, x10)
Stereo microscope (x20)
Intel PC controlled inspection microscope (x10, x60, x200)
Oscilloscopes, bench-top power supplies, DVM's, BERT tester, function generator, test PC's etc.
BJZ de-panelling machines for routered & scored PCB's.
Clarke 6" linesher.
Branson 1510 Ultrasonic cleaning bath (1800cm3 capacity)
ICE Technology programmer for PIC/GAL/EPROM etc.
IDC press tool