Newbury Electronics
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Site Last Updated: Wednesday, March 26, 2008
| Copper foil: | RA copper | 17.5, 35, 70 microns |
| Copper foil: | ED copper | 17.5, 35, 70 microns |
| Base film: | Polyimide | 17.5, 25, 50 microns |
| Base film: | Polyester | 25, 50, 75 microns |
| Coverlay: | Polyimide | 25, 50, 75 microns |
| Coverlay: | Polyester | 17.5, 35, 70 microns |
| Coverlay: | Solder mask | 25, 50 microns |
| Adhesive: | Epoxy | 20 - 35 microns |
| Adhesive: | Acrylic | 20 - 35 microns |
| Stiffener: | Polymide | 25 - 175 microns |
| Stiffener: | Polyester | 25 - 300 microns |
| Stiffener: | Glass-epoxy | 0.1 - 1.6 mm |