PCB Manufacturing Capability
- Materials: High Tg Fr4, Polyimide, PTFE, Aluminium based copper clad laminate
- Solder resists: Liquid photo-imageable, colours: green, red, blue, black, white, silver grey
- Legend inks: white standard, yellow, black
- Multi-layer: layer counts from 1 to 12 layers
- PCB thicknesses from 0.2mm to 3.2 mm
- Copper weights: 1/2 oz to 3 oz
- PCB finishes:
Hot air solder level both lead-free and leaded
immersion silver (0.2 mic)
immersion gold (0.1 mic) over electroless nickel (5 mic)
- Min track and gap: 0.1 mm on 1/2 oz copper start, 0.15 mm on 1 oz copper start, 0.2 mm on 2 oz copper start
- Smallest drill at size: 0.2mm Smallest recommended drill size: 0.3mm
- Minimum recommended gap between SMD pads: 0.125mm
- Minimum solder resist to copper clearance: 0.1 mm
- Maximum plated hole depth to diameter aspect ratio on a 1.6 mm thick PCB is 6:1
- Mechanical: edge chamfering, counter-sinking, counter-boring, routing, scoring all available.