Reworking Electronic Assemblies

Commonly, rework of electronic assemblies can be considered to involve the removal of components and their safe and efficient replacement without damage to the PCB or component or indeed adjacent components in any way.

This may require specialist equipment to locally reflow solder joints for removal of the part without overheating and damaging the circuit. For the rework of delicate components such as BGA’s, we use a PDR focused infrared D35Vi BGA/SMT rework system which uses a beam of infrared heat which is applied specifically to the area in question. The same machine is equipped with cameras which enable the precise replacement SMD parts perfectly in registration with their pads.

Leaded parts are more easily reworked with the aid of Hakko solder extraction guns and hot-air rework units. All reworked parts will be inspected under a binocular vision microscope and high-resolution X-ray machine as necessary.

Specialist rework may require holes to be CNC drilled, tracks to be cut by laser milling, new solder pads to be created by laser ablation, localised conformal coating, or localised solder pasting and reflow. We have the tools at our disposal to do any of this.

Reworking may involve a wide variety of skills and materials, but we have never been beaten by a challenge yet. Ask us to quote.

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