X-Ray Inspection
An increasing number of components have their solder pad connections underneath the body of the part so that the solder joint is not open to visual inspection, for example BGAs and QFNs.
An increasing number of components have their solder pad connections underneath the body of the part so that the solder joint is not open to visual inspection, for example BGAs and QFNs.
It is essential that the integrity of solder joints is inspected and the only practical method is X-ray.
We are equipped with Nikon Metrology XTV160 X-ray machine (160KV anode voltage) with CT (computer tomography) 3D capability. This high-power X-ray inspection equipment has excellent resolution and allows resolution of features as small as 25 microns. Articles under inspection can be tilted and rotated in the field of view as well as allowing complete adjustment of magnification.
X-ray inspection is a standard part of our assembly process but we also provide it as a service to clients if required.